IBM Awarded National Medal of Technology for Semiconductor Innovation16 November 2005
President George W. Bush
announced today that IBM has been awarded the 2004 National Medal of
Technology by the U.S. Department of Commerce and the Technology
Administration in recognition of more than four decades of innovation in
semiconductor technology.
The award recognizes IBM advances that have improved the performance and
versatility of today's microprocessors, citing significant breakthroughs
such as the development of
multicore-processor integration, DRAM (Dynamic Random Access Memory), the
use of copper on-chip wiring, Silicon on Insulator (SOI) technology, and
high-speed Silicon Germanium chips.
The National Medal of Technology is the highest honor awarded by the
President of the United States to America's leading innovators. It
recognizes companies and individuals who have made lasting contributions to
America's competitiveness, standard of living, and quality of life through
technological innovation, and substantial contributions to strengthening
the nation's technological workforce.
(Click here for details) IBM Vice President Lisa Su with a Cell microprocessor wafer at the company's fab in East Fishkill, NY. President George W. Bush today announced IBM as a National Medal of Technology winner for chip breakthroughs.
"At IBM, we understand that the true value of innovation comes not from the
invention but rather the application of new technology to benefit business
and society," said Nick Donofrio, executive vice president, innovation and
technology. "Our four decades of breakthroughs in semiconductors have made
possible many new products and services that greatly enhance the quality of
our lives and our ability to conduct business more efficiently and
productively. We're honored to be recognized for our long-term commitment
to basic research and development -- and more motivated than ever to extend
the limits of what is possible in the future."
IBM is recognized as a global leader in the development and manufacturing
of state-of-the-art semiconductor and interconnect technologies, including
the company's industry-leading Power Architecture microprocessors. IBM
semiconductor technology is the heartbeat of digital devices large and
small, from cameras and mobile phones, to the world's most powerful
supercomputers.
IBM is dedicated to the concept of 'collaborative innovation,' and is
engaged in joint development projects with the world's leading
semiconductor developers to advance the science of nanotechnology. In East
Fishkill and Albany, New York; Burlington, Vermont; Austin, Texas;
Rochester, Minnesota; San Jose, California; and other locations, IBM is
working side by side with the world's technology leaders.
IBM innovations in microelectronics and the company's groundbreaking
System-on-a-Chip design strategy have transformed the world of
semiconductors. Among the breakthroughs pioneered by IBM:
Copper conductors -- Copper conducts electricity 40 percent more
efficiently than aluminum. IBM researchers pioneered the use of tungsten
to create copper-based chips capable of running significantly faster than
aluminum-based technology.
Silicon-germanium (SiGe) -- Used in bipolar chipmaking in place of the more
expensive gallium arsenide process, SiGe allows for significant
improvements in operating frequency, current, noise, and power
capabilities, particularly for today's mobile wireless devices.
Silicon on insulator (SOI) -- Placing a thin layer of insulation between
the silicon surface and the transistors protects the transistors from
electrical effects, resulting in improved performance and lower power
consumption.
Strained silicon -- This technique strains (or stretches) silicon, thus
speeding the flow of electrons through a chip, increasing performance and
lowering power consumption without any miniaturization. When coupled with
SOI, the use of strained silicon speeds performance and further decreases
power consumption.
Chemically amplified photoresists -- This innovation uses clever
light-sensitive chemistry to enable ever-smaller circuit features to be
transferred to the silicon wafer and reliably manufactured.
Established by an act of Congress in 1980, the Medal of Technology was
first awarded in 1985. By highlighting the national importance of
technological innovation, the Medal also seeks to inspire future
generations of Americans to prepare for and pursue technical careers to
keep America at the forefront of global technology and economic leadership.
IBM last received the Medal of Technology in 2000 for innovation in the
technology of hard-disk drives and information storage products.
About IBM
IBM semiconductors are a major contributor to the company's position as the
world's largest information technology company. Its chip products and
solutions power IBM eServer and TotalStorage systems as well as many of the
world's best-known electronics brands.
IBM semiconductor innovations include dual-core microprocessors, copper
wiring, silicon-on-insulator and silicon germanium transistors, strained
silicon, and eFUSE, a technology that enables computer chips to
automatically respond to changing conditions. More information is
available at: http://www.ibm.com/chips
Note to Photo Editors: Photos of IBM semiconductor innovations are
available at:
http://www-03.ibm.com/chips/photolibrary/photo10.nsf/WebViewNumber?OpenView&Start=1&Count=5&Press
Contact:
Glen Brandow
brandow@us.ibm.com
914-766-4615
SOURCE: IBM
Source: Marketwire
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